Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Thermal Buffer Molybdenum Copper Substrate Welded To DBC On Chip Description: With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable ...

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molybdenum element

mocu heat sink

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