High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages

Name: High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages
Brand: JBNR
Price: 1 USD

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.5

CTE : 11.5

TC : 230-270

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High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages

Description:

Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Advantages:

High thermal conductivity since no sintering additives have been used

Excellent hermeticity

Relatively small density

Stampable sheets available (Mo content no more than 75 wt%)

Semi-finished or finished (Ni/Au plated) parts available

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product picture:

High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages

Product Tags:

tungsten copper heat spreader

copper molybdenum heat base

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